Research on the heat-resistant microencapsulated phase change materials by interfacial polymerization
Heat-resistant microencapsulated phase change materials (MPCMs) were prepared via interfacial polymerization, with polyurea used as the shell and low melt-point paraffin wax as the core. TG (Thermogravimeter), FTIR (Fourier Transform Infrared Spectro-photometer) and LPSDA (Laser Particle Size Distribution Analysis) were employed to evaluate the properties of the materials. The influence factors on polymerization were discussed. Experimental results indicated that the heat-resistant temperature of final products reached up to 240℃.
XIN Changzheng WANG Yanwei WANG Lina HUANG Xiang’an
State Key Laboratory for Modification of Chemical Fibers and Polymer Materials,Donghua University, S Henan Institute of Engineering, Zhengzhou, 450007, P.R.China State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University,
国际会议
2009 International Conference on Advanced Fibers and Polymer Materials(2009年先进纤维与聚合物材料国际学术会议)
上海
英文
201-203
2009-10-21(万方平台首次上网日期,不代表论文的发表时间)