DESIGN AND PREDITION OF THERMAL CONDUCTIVITY OF SILICA-BASED FILMS PREPARATED BY HEXAMETHYLDISILAZANE AND POLYETHYLENE GLYCOL
Thermal conductivity plays an important role in dominating a silica-based films’ behavior in heat conduction processes and its applicability. Thus it is important to develop a predicting method for the thermal conductivity to improve the thermal design and manufacturing processes of the silica-based films which are prepared by using Hexamethyldisilazane (HMDZ) and Polyethylene Glycol. Based on the microscopy theories of heat conduction, a new method of predicting the thermal conductivity in close relationship to the cubic unit cell structure model of silica-based films is developed in this paper. A new formula for calculating thermal conductivity is proposed. The thermal conductivity values calculated by using the formula are compared with the values obtained by experimental measurement and found to be in good agreement for silica-based films with lower thermal conductivities. It is discovered in further analysis that the thermal conductivity is related to volume-concentration of HMDZ, density, and thickness of the films, and that the prediction method is likely to be more useful in improving the fabrication and thermal design of silica-based films.
Qingren Wu Qijian Wu Yibin Xu
Key Laboratory of Special Functional Materials for Ministry of Education South China University of T College of Materials Science and Engineering South China University of Technology Guangzhou ,China, Materials Information Technology Station National Institute for Material Science 2-2-54 Nakameguro,M
国际会议
The Ninth Asian Thermophysical Properties Conference(第九届亚洲热物理性能会议 ATPC 2010)
北京
英文
108-115
2010-10-19（万方平台首次上网日期，不代表论文的发表时间）