THERMAL DIFFUSIVITY OF THE Sn-Ag-Cu BASED Pb-FREE MICRO AND NANO SOLDER BALLS
In order to find the grain size and shape effects onthe thermophysical properties, several kinds of Sn-3.0Ag-0.5Cu solder balls with different average balldiameters of 170 nm, 10, 29, 140 μm were prepared anddisk type samples were formed by pressing with differentpressures of 100, 200, and 300 psi. The thermaldiffusivity of the sample was measured by laser flashapparatus from room temperature to 150 ℃ and the resultshows that as the diameter of solder ball and thecompaction pressure increase, the thermal diffusivityincreased. Also, thermal diffusivity decreased about 28 ％ at maximum with the temperature increment.Among them, the sample with grain diameter of 140 μm prepared under the compaction pressure of 300 psiwas exhibited highest thermal diffusivity about 30×10-6m2/s. So it was found that the thermal diffusivity ofsolder ball is strongly dependent on the size, shape and temperature.
InGoo Kim Man Il Kang Sok Won Kim
Department of Physics University of Ulsan Ulsan, Korea, 680-749
国际会议
The Ninth Asian Thermophysical Properties Conference(第九届亚洲热物理性能会议 ATPC 2010)
北京
英文
236-240
2010-10-19（万方平台首次上网日期，不代表论文的发表时间）