THERMAL CHARACTERIZATION OF HYSOL EPOXY PASTE ADHESIVE
Hysol EA 934NA adhesive is planned for use in India’s G-SAT6 communication satellite. The adhesive bonded systems are exposed to temperatures in the range of -125℃ to+150℃. Hence, a thorough thermal characterization of the cured adhesive was carried out by standard thermal techniques like, differential scanning calorimeter, thermo gravimetric analysis and thermo mechanical analysis. The thermal stability was evaluated in the proposed temperature range. The glass transition of the material was observed around 65℃. The properties of the adhesive were also measured in the selected temperature range. The specific heat varies from 0.65 to 1.65 J/g/℃ and the mean coefficient of thermal expansion by curve fit is found to be 72μm/m℃.
Ramakrishnan V Raghavendra Kumar D Ramasamy A Dinesh Kumar Badari Narayana K
Thermal Systems Group ISRO Satellite Centre Bangalore, India, 560017
国际会议
The Ninth Asian Thermophysical Properties Conference(第九届亚洲热物理性能会议 ATPC 2010)
北京
英文
1011-1018
2010-10-19（万方平台首次上网日期，不代表论文的发表时间）