9th ASIAN THERMOPHYSICAL PROPERTIES CONFERENCE THERMOPHYSICAL PROPERTIES OF POLYIMIDE/INORGANIC COMPOSITE FILMS
Thermal diffusivities and specific heats of polyimide (PI), PI/C and PI/SiO2 thin films from 20 to 160℃ were measured by laser flash technique and differential scanning calorimeter (DSC) respectively and further the thermal conductivity was obtained. The effects of temperature and additions of nanometer silica and carbon on thermophysical properties were investigated. The results showed that both silica and carbon could reduce specific heats and increase thermal conductivities. The increasing trend of thermal conductivities of PI with temperature increasing did not been changed after silica or carbon was added into PI. The thermal conductivity of PI/SiO2 quickly increased when the content of silica changed from 10％ to 20％ because the contact with each other strengthened the heat conduction and the larger particle size resulted in the less phonons scattering. The thermal conductivity of PI/C with 30％ carbon was less than that with 20％ silica because the smaller particle sizes of carbon resulted in the stronger phonon scattering.
Polyimide/inorganic composite films thermal conductivity specific heat laser flash method
Liping Yang An Cai Tonggeng Xi
Shanghai Institute of Ceramics, Chinese Academy of Sciences (SICCAS) 1295 DingXi Rd. Shanghai, 200050, China
国际会议
The Ninth Asian Thermophysical Properties Conference(第九届亚洲热物理性能会议 ATPC 2010)
北京
英文
1040-1043
2010-10-19（万方平台首次上网日期，不代表论文的发表时间）