A compact system-level simulation method for modern microelectronic packaging
For wafer-level packages with numerous solder balls and other repetitive structures, it’s not practical to analyze the waferlevel behavior of the whole structure with the conventional finite-element method (FEM). A package-level nodal analysis method (PLNAM) is developed based on the partitioning concept. Using the functional elements, rather than the finite element in FEM, a large or complex package system can be interpreted using a simpler model with the elements interconnected through nodes. Result shows that the error of the nodal displacement can be kept within 5％ with proper consideration of the surface compliance effect and the simulation process is much faster than FEM.
Shihu Sun Jing Song Qing-An Huang
Key Laboratory of MEMS of Ministry of Education Southeast University, Nanjing, 210096, China
国际会议
西安
英文
74-76
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）