A Finite Element Simulation of PoP Assembly Processes

摘要：

Warpage, high stress in dies and solder joints are introduced in assembly process of a package-on-package component. In this paper, a finite element approach is proposed to predict the warpages and stresses during the full assembly process. By the techniques of element die and birth as well as restart method, the approach is able to transfer the stress and warpage in one process to the next so that a full evolution of the stress and warpage during assembly can be obtained. The simulation results show that the approach is feasible and effective, and it can be used to optimize the packaging process.

关键词： Electronic Packaging PoP Assembly processes Finite element method

作者: REN Chao QIN Fei WANG Xuming

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing 100124, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 112-115

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）