A Micro In-Situ Pirani Vacuum Gauge for Microsystem Package Applications

摘要：

A novel micro-Pirani vacuum gauge applied in microsystem packages has been experimentally investigated. The gauge consists of a micro metal hot-wire, which is bonded on the pads of the LTCC substrate of a microsystem package and hangs over a cavity micromachined into the substrate. With a simple structure, this gauge may provide an in-situ and realtime monitoring of the vacuum inside the chamber of microsystem packages. This paper looks into the fundamental characteristics of this kind of micro-Pirani gauge. The performance characteristic curves are measured for metal wires with various length and current load. Based on the data thus obtained, the impacting factors are found out to optimize the micro-Pirani gauge.

作者: Hua Gan Yunsong Qiu Min Miao Yufeng Jin

作者单位: National Key Lab on Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking Univers National Key Lab on Micro/Nano Fabrication Technology, Institute of Microelectronics, Peking Univers

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 125-129

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）