The anti-pyramid distribution in SIP using LTCC technology

摘要：

The anti-pyramid stacked chips distribution that can be applied in SIP is reported to have a much better thermal performance comparing to the widely used pyramid distribution. When the package of system is using PCB and LTCC condition, the highest temperature is brought down from 440 °K to 417 °K and from 326 °K to 319 °K respectively. In addition, it is also analyzed that the antipyramid distribution makes the LTCC packaged system not only has better thermal performance, but also be more reliable. So it is strongly suggested that when the SIP encounter some serious thermal problem, both anti-pyramid stacked chips and LTCC technology should be applied to overcome this problem.

作者: Yingli Liu Yuanxun Li Yunsong Xie Huaiwu Zhang Daming Chen Jie Li

作者单位: State Key Laboratory of Electronic Thin Film and Integrated Devices,University of Electronic Science and Technology of China No.4,Section 2,North Jianshe Road,Chengdu,P.R.China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 16-18

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）