Development of Flip-Chip Interconnections of Photodetector Readout Circuit (ROIC)
In this paper, the interconnection between 16x16 photodetector ROIC and substrate for the ROIC test was developed. Three kinds of substrate methods, i.e. high-density organic substrate, silicon interposer substrate and throughsilicon via (TSV) technology, were adopted. Three corresponding technical process flows were designed, and corresponding experiments were conducted. Finally, the interconnection between photodetector ROIC and substrates as well as the test of ROIC performance were realized. Above three solutions were compared and evaluated in process realizability, interconnection performance and cost etc. It turns out that TSV method is considered as the advanced and ideal interconnection solution for the test of 16x16, 32x32 and 64x64 photodetector ROIC.
Interconnection Flip-chip(FC) Through-silicon via(TSV) Re-distribution layer(RDL) Interposer substrate Readout circuit(ROIC)
Gaowei Xu Qiuping Huang Yuan Yuan Xiao Chen Le Luo
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai 200050, China
国际会议
西安
英文
31-33
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）