Orientation Relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

摘要：

TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

作者: Pan-Ju Shang Zhi-Quan Liu Douxing Li Jian-Ku Shang

作者单位: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Department of Materials Science and Engineering, University of Illions at Urbana-Champaign, Urbana,

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 165-169

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）