Creep Behavior Investigation of Lead-Free Solder Alloy Sn96.5Ag3Cu0.5

摘要：

The creep properties of the lead-free solder alloy Sn96.5Ag3Cu0.5 were investigated and compared with those of the typical Pb-containing solder Sn63Pb37. Creep tests of this lead-free solder Sn96.5Ag3Cu0.5 and Pb-containing solder Sn63Pb37 under different temperature environment of 25 ℃, 125 ℃ were conducted at different constant stress levels and a series of consistent and reliable creep data were obtained. It could be found that circumstance temperature was the key part of affecting the creep properties of two solder alloys Sn96.5Ag3Cu0.5 and Sn63Pb37. The lead-free solder alloy Sn96.5Ag3Cu0.5 showed good creep resistance and deformation resistance; the creep behavior of this lead-free solder Sn96.5Ag3Cu0.5 revealed the temperature sensitivity. Creep resistance of Sn96.5Ag3Cu0.5 revealed that the leadfree solder alloy Sn96.5Ag3Cu0.5 had some attractive mechanical properties.

作者: Fulong Zhu Shao Song Wei Zhang Sheng Liu

作者单位: Institute of Microsystems, School of Mechanical Science and Engineering, HuaZhong University of Scie Institute of Microsystems, School of Mechanical Science and Engineering, HuaZhong University of Scie

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 195-198

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）