New Fast Curing Isotropic Conductive Adhesive for Electronic Packaging Application
With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute of solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, the curing time of most traditional ICA is more than half an hour. The process duration of ICA is 2 or 3 times longer than that of solder. Thus, low efficiencies of energy using and product manufacturing has been one of factors which limits widely application of ICA. Generally, the curing speed of ICA depends on types and amount of curing agent as well as curing temperature. In our previous experiments, the effects of curing temperature and amount of curing agent have been investigated. So, the present work attempts to choose a new kind of curing agent to shorten process duration of ICA. By using new curing agent, the curing duration of ICA could be shortened in 5 minutes with a high curing rate compared with the previous version. In addition, the basic performance including bulk resistivity and viscosity are also investigated in this work. Finally, we present some discussions about the further optimization of performance, for example regarding the ways of achieving better electrical conductivity with lower filler content and improvement of viscosity etc.
Wenhui Du Chune Fu Si Chen Huiwang Cui Xiaohua Liu Tianan Chen Johan Liu
Yanchang Road 149, Shanghai 200072, P.R. China Key State Laboratory for New Displays & System Applic Yanchang Road 149, Shanghai 200072, P.R. China Key State Laboratory for New Displays & System Applic SMIT Ltd Co, No 101 of New Science and Technology Building, Science Park, No 149, Yan Chang Road, Sh Yanchang Road 149, Shanghai 200072, P.R. China Key State Laboratory for New Displays & System Applic
国际会议
西安
英文
199-201
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）