Interfacial Reaction and Melting/solidification Characteristics between Sn and different metallizations of Cu, Ag, Ni and Co
The interfacial reaction between pure Sn and different metallizations of Cu, Ag, Ni and Co, as well as the melting/solidification characteristics of each reaction system were investigated using a differential scanning calorimeter (DSC). Results show that there exists the early interfacial eutectic reaction in Sn/Cu and Sn/Ag systems, which leads to the occurrence of the Sn melting at the interface at a temperature 4.9 ℃ (for Sn/Cu system) and 10.6 ℃(for Sn/Ag system) lower than the actual melting point of pure Sn (231.9 ℃), and consequently both of Sn/Cu and Sn/Ag soldering systems exhibit scallop-like morphology of intermetallic compound (IMC). Although there was the diffusion of Ni and Co atoms into pure Sn, no obvious change in the melting temperature of Sn/Ni and Sn/Co soldering systems, compared to the melting point of pure Sn, was observed, and the interfacial morphologies of Sn/Ni and Sn/Co systems showed platelet-like IMC. In addition, it has been shown that the undercooling values of Sn/Ni and Sn/Co systems are much smaller than that of Sn/Cu and Sn/Ag ones.
ZHOU Min-Bo QIN Hong-Bo MA Xiao ZHANG Xin-Ping
School of Materials Science and Engineering, South China University of Technology,Guangzhou 510640, China
国际会议
西安
英文
202-207
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）