Replace Ball Attach by Developing Substrate Solder Bumping for 0.5mm Pitch FBGA
As the solder ball pitch of BGA packages decreases to 0.5mm↓, the conventional solder ball attach process runs into the bottle neck. The capability limit of S/B/A equipment being widely used now is attaching 0.5mm pitch-0.3mm solder ball. It needs to upgrade the equipments and purchase new flux & attach tools to meet the ultra fine pitch process demand, which would require much investment. Thus research on cost-effective solutions is deserved. This paper discusses the substrate solder bumping technology by solder paste screen printing, to offer an economical approach for pitch 0.5mm↓ soldering interconnection. The 0.4mm pitch-0.2mm pad open FBGA component with 172 I/O count is adopted as the target device. Bumping is conducted on one strip of molded substrate with 96 components. Strip warpage resistant, bump dimension and coplanarity control, bridging issue resolving and yield assurance are all challenges for the solder bumping process development. Finally this process is setup. Good process capability could be assured to get bumps with 200um size, 130um height and 30um cop. Theses bumps could fulfill interconnection demand. And so solder bumping is approved to be a feasible solution to replace solder ball attach for ultra fine pitch usage.
Lei Wang Zhenqing Zhao Jiangtao Liu Jaisung Lee
Samsung Semiconductor China R&D Co. Ltd.No. 15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China 215021
国际会议
西安
英文
229-234
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）