Effect of nano-TiO2 addition on wettability and interfacial reactions of Sn0.7Cu composite solder/Cu solder joints

摘要：

The influences of intermixing nano-TiO2 particles on the wettability and interfacial reaction of Sn0.7Cu composite solder with Cu substrate were investigated. The wettability of the Sn0.7Cu composite solder alloy was measured by the sessile-drop method under a 10-3 Torr vacuum solder at 250 oC up to 1800 s. Scanning electron microscopy (SEM) was used to quantify the interfacial microstructure for each processing condition. The wettability property was improved by 0.25-1.0 wt.％ addition of nano-TiO2 particles into the Sn0.7Cu solder. Intermetallics formed at the Sn0.7Cu composite solder/Cu interface were identified as Cu6Sn5 adjacent to the solder and Cu3Sn IMCs adjacent to the Cu substrate, respectively. The addition of nano-TiO2 particles to the Sn0.7Cu solder effectively repressed the growth of the IMC layer at the interface.

作者: L.C. Tsao B. C. Wang C. W. Chang M. W. Wu

作者单位: Department of Materials Engineering, Pingtung University of Science & Technology, Taiwan, China Department of Materials Science & Engineering, National Formosa University, Taiwan, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 250-253

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）