Dielectric Composite Material with Enhanced Thermal Conductivity Used for Electronic Packaging
The current trend in the integration and miniaturization of high-power electronic components requires a dielectric material with high thermal conductivity, which can conduct fast heat dissipation to prevent the circuit and substrate from overheating. Adding ceramic powders with a high thermal conductivity into the polymer is an effective way to enhance the thermal conductivity of the dielectric material. In our research, Halogen-free bisphenol-A epoxy and aluminum nitride (AlN) were chosen as the matrix and filler, respectively. The impact of AlN content on the thermal and insulating properties of the composites were investigated. A high thermal conductivity of 2.10 W/(m·K) was achieved with an AlN content of 55.9 ％ and a dielectric strength of 10-11 kV/mm was obtained. The viscosity of pre-curing suspension was also measured and the experimental data showed that the viscosity dramatically increased at an AlN content of 40％.
thermal conductivity dielectric material aluminum nitride composite thin film
Hui Yu Liangliang Li Teruo Kido Guannan Xi
Department of Materials Science and Engineering, Key Lab of Advanced Materials, Tsinghua University, Environmental Technology Laboratory, Daikin Industries, LTD, Osaka, 591-8511, Japan
国际会议
西安
英文
258-262
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）