Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process

摘要：

Indium bumping is a crucial technology in FPAs (focal plane array) application. In this paper, electroplating method is tried to prepare the indium bump arrays. But one difficulty appears during the reflow process. In such process, many indium bumps fall off from the substrate. To solve such problem, its possible causes are discussed and the corresponding measures are taken. Experimental results show that the measures can effectively improve status of the falling off of indium bumps, which is consistent with the reasonable analysis. To analyze the influence of reflow process to the stress in the bump system, finite element analysis with ANSYS is adopted in this paper.

作者: Qiuping Huang Dongliang wang Gaowei Xu Yuan Yuan Quan wang Le Luo

作者单位: Shanghai Institute of Microsystem and InformationTechnology,Chinese Academy of Sciences,No. 865 Changning Road, Shanghai, 200050, Shanghai, China,

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 267-270

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）