The investigation of high temperature joint generated by low temperature process
A number of new bonding techniques are emerging with the development of three dimensional (3D) stacking packaging. High temperature joint generated by low temperature process with traditional soldering process was one of the approaches to meet the bonding requirement for 3D packaging. Cu/Cu was bonded with joint gap of 100 micros and 60 micros via a layer of Sn plated on the Cu surface. Coupons were fluxed and reflowed at 250℃ with different times. The effect of relative IMC thickness on the shear properties was studied. It was revealed that a lacking of ductility for all the Cu/Sn/Cu bondings even IMC was extremely thin. When intermetallic compound grew thicker and gradually dominated the interface, a corresponding increase of shear strength was observed. The shear on IMC 60 micros gap, reflow 12 hours) showed the highest shear strength but a brittle rupture feature. This work enlightened an approach on the evaluation of thin film interfacial strength and also provided an insight into 3-D stacking packaging design.
Cai Chen Lei Zhang Lizhang CM Lai Eric Kuo KH Tan
Shenyang National Laboratory for Materials Science Institute of Metal Research, Chinese Academy of S Jiangyin Changdian Advanced Packaging Co., Ltd.NO.275 Bingjiang Rd, Jiangyin, Jiangsu 214431, Chian
国际会议
西安
英文
271-274
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）