Toughness Improvement Study of Epoxy Molding Compound
The effects of filler loading, types of rubber (elastomer) and glass transition temperature (Tg) on mold compounds toughness at room and high temperature (240℃) were investigated. The new simplified toughness test method based on ASTMD5049 was also developed. The study was done with L39 Taguchi method, 3 factors with 3 levels. The factors are filler percentage (88％,89％ and 90％,) Tg value (defined as level 1, 1.5 and 2) and 3 types of rubber (A, B and C). In addition, the warpage of the materials using QFN package (4x4 and 7x7) was also characterized in this experiment. The results showed that at room temperature, the highest toughness was attained by the material with all 3 factors at the middle level. Whilst at high temperature of 240 oC, the highest toughness was attained by the sample with the highest filler loading, highest Tg value and C type of rubber. In terms of warpage, 90％ filler loading material showed the lowest warpage on QFN, 4 x 4, and for QFN 7 x 7, 89％ filler loading showed the best warpage performance. There was no significant effect on warpage with Tg range from 128 ℃ to 142 ℃. Rubber A has proven to be the most significant factors contribute to warpage performance which showed the best warpage performance on both QFN 4 x 4 and 7 x 7.
Wei Tan Hongjun Liu Kok-Soo Goh Hongjie Liu Xingming Cheng
Henkel Huawei Electronics Co., Ltd.Songtiao Industry Park,Lianyungang,Jiangsu,China 222006
国际会议
西安
英文
145-147
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）