Development of Green Molding Compound for High Voltage Discrete Package
The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power application. It must pass the relative electrical performance and standard JEDEC Level testing. Currently green molding compound always meet some H(3)TRB failure on high voltage device and delamination issue after MSL1 precondition with lead free soldering condition. It becomes a challenge for molding compound supplier to design suitable green material to satisfy both reliability and moldability test. In this study, the failure mode of HTRB was discussed and some key raw materials were tested in formulation to understand different raw material effect on HTRB performance. The adhesion to lead frame was measured to show different material effect on interfacial adhesion strength. All materials were molded on SOT23 test vehicle and subject to HTRB and Standard JEDEC Level testing. The long term moldability was also tested in this study. It was found with certain material had good HTRB result on SOT package with high voltage application.
EMC HTRB Delamination Moldability Discrete
Guangchao Xie Jianhua Ruan Yue Wang Xinyu Du Xingming Cheng
Henkel Huawei Electronics Co., LTD Songtiao Industrial Park, Lianyungang, Jiangsu, China 222006 LESHAN-PHENIX Semiconductor Co., LTD 289 West People Road, Leshan, Sichuan, China 614000 Henkel Corporation 15350 Barranca Pkwy, Irvine CA 92618
国际会议
西安
英文
148-151
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）