Effects of Bump Metallurgies, Underfill Material and its Cure Process on Package Warpage

摘要：

Excessive warpage in flip-chip packages would raise concerns of process stability and reliability as well as customer acceptance concerns, making it critical to understand the thermal-mechanical mechanism of package warpage. In this paper, we report our comprehensive study focusing on the effects of the bump metallurgies, underfill material and its cure process on the package warpage. The warpage of the units with the Pb-free bump joints and its dependence on the underfill and its process were found significantly different from the units with other bump joints. The underline mechanism of package warpage formation is discussed.

作者: Jieping Zhang Dongwen Gan Jinlin Wang Jayaraman Saikumar Li-Hsin Chang

作者单位: Assembly & Test Technology Development, Intel Corporation, Chandler, Arizona 85226, USA

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 330-336

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）