Underfill Cure Induced Micro-Anomaly (CIMA) And Its Mechanism and Reliability Implications

摘要：

Cure Induced Micro-Anomaly (CIMA) are worm like hollow microstructures found within resin rich region of underfill after curing within a BGA package with combination of copper die bumps and Sn-Ag substrate bumps. CIMA leads to solder extrusion during secondary reflow. Root cause of CIMA has been identified to be from thermal mechanical stress induced by the stiffness of the joints formed between the die and substrate, dissipation of stress causes the underfill to crack. Addition of stress induction from package warpage, high Prebake temperature has shown to worsen effects of CIMA. Step-cure and flip curing has shown to reduce the effects.

作者: Jieping Zhang Marcus Hsu Saikumar Jayaraman

作者单位: Assembly and Test Technology Development Intel Corporation Chandler, AZ

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 337-341

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）