Thermal Stress Characteristics of Cu Interconnects Using Air-Gap

摘要：

Based on the elastic-plastic model, two-dimensional finite element analysis was used to analyze the Air-Gap Cu interconnects thermal stress behaviors. Firstly, the stress evolution with the Air-Gap interconnect formation process steps was studied. Then, two Air-Gap types of Cu interconnects, with Air-Gap in the metal line level or extending to via level, combined with three different dielectrics were modeled to evaluate their stress characteristics. The research result is helpful to understand the influence of the dielectric and Air-Gap structure on the Cu interconnects reliability.

作者: LIN Xiao-ling HOU Tong-xian Zhang Xiao-wen YAO Ruo-he

作者单位: Institute of Microelectronics, School of Electron and Information Engineering,South China University Institute of Microelectronics, School of Electron and Information Engineering,South China University National Key Laboratory of Science and Technology on Reliability Physics and Application of Electric

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 363-367

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）