Temperature Effect on IMC Growth Behavior of Thin Film Copper-Aluminum System in Electronic Packaging
It is widely accepted that wire bonding is the predominant method for the area of microelectronic packaging. Currently, copper wire has been studied to substitute the gold and aluminum ones in this process owing to its several advantages. However, the nanoscale interfacial characteristics of thermo sonic copper ball bonding on aluminum metallization should be carefully investigated. In this paper, a serious of examination is designed to find the IMC generates in the beginning of the electronic packaging process in two different kinds of temperature. Then, the data and results in the experiment are demonstrated in detail. Finally, some conclusions concerning the experiment are drawn from the previous work.
Xuefei Ming Yi Zhang
Department of Mechanical Engineering, The Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong, China
国际会议
西安
英文
371-375
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）