Investigation on Fabricating High SiC Volume Fraction of Electronic Package Shell by Means of Semisolid Forming
Based on the research of modern electronic packaging materials, Semi-solid forming technology was used to fabricate electronic packaging shell in this study. Packaging material of SiC reinforced A356 aluminum alloy was prepared by mechanical mixing method and the SiCp/Al composite billet was formed by means of thixo-forging to manufacture the electronic packaging shell. The numerical simulation was conducted for investigating the process of thixo-extrusion with SiCp/A356 composites. Then microstructure of the produced parts and simulation results were investigated. The results showed that after being heated to 600 ℃ and held for 3 hours, SiCp had good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet could meet the requirements of thixo-forging. The investigation showed that thixoforming technology could be used in producing electronic package shell with high SiC volume fraction from SiCp/A356 composites.
Electronic packaging shell High SiC volume fraction Semi-solid forming SiCp/A356 composites Numerical simulation Microstructure.
WANG Kai-kun LI Jian LI Ming-rong XIE Qi-lin WANG Fu-yu
School of Materials Science and Engineering, University of Science and Technology Beijing. Beijing 1 East China Research Institute of Electronic Engineering. Anhui 230088, P .R .China
国际会议
西安
英文
394-398
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）