Microstructure and solderability of Sn-3.5Ag-0.5Cu-xBi-ySb solders
Lead-free solders were prepared by adding a small quantity of Bi, Sb element into Sn-3.5Ag-0.5Cu alloy. By means of OM, SEM,EDS, DTA and solderability test, effects of Bi and Sb elements on microstructure, solderability and melting characteristic were investigated. The results show that with the increase of Bi and Sb addition into Sn-3.5Ag-0.5Cu solder, the primary β-Sn phrase decreased gradually and tiny inter-metallic compounds increased. Bi presents obvious effects on depressing the melting temperature but broadening the melting range. And the addition of Sb has little effect on melting temperature but broadens the melting range too. Adding suitable amount of Bi and Sb into the solder alloy may help improve the solderability.
Sn-Ag-Cu-Bi-Sb lead-free solder melting temperature solderability microstructure.
Sheng LU Zhixia Zheng Jing CHEN Fei LUO
Department of Welding and Materials Forming,2 Mengxi Road, Zhenjiang, Jiangsu, 212003, PRC Department of Mechanical Engineering Jiangsu University of Science and Technology 2 Mengxi Road, Zhe
国际会议
西安
英文
410-412
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）