Abnormal growth of intermetallic compounds in asymmetrical Cu/Sn/Ag couples
The current study revealed that the growth kinetics and the interfacial reaction of the Cu/Sn/Ag couples with different thickness solder. For the Cu/Sn/Ag couples, plate-type Ag3Sn was firstly formed at the Sn/Cu interface rather than at the Sn/Ag interface for the Cu/Sn/Ag couple at the initial state of the reflow procedure when the solder thicknesses is 150 μm or 300 μm. Besides, the microstructure of the Cu/Sn interface was different from that of Ag/Sn interface for the Cu/Sn (300 μm)/Ag couple. With increasing reflow time to 60s, plate-type Ag3Sn was detected at Sn/Ag and Sn/Cu interfaces, and the columnar Cu6Sn5 grains were also observed at the Cu/Sn interface for the Ag/Sn (150 μm)/Cu couple under liquid-state condition. However, for the Cu/Sn(40μm)/Ag couple, columnar Cu6Sn5 and plate-type Ag3Sn were not observed, and few Cu-Sn IMC particles were observed in the solder even after long time aging. The growth kinetics of intermetallic compounds was also investigated for the Cu/Sn/Ag couples with different thickness solder.
H. F. Zou Z. F. Zhang
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, P.R. China
国际会议
西安
英文
418-421
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）