Performance of Silver-Glue Attachment Technology in Assembly

摘要：

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxy-resin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.

作者: Mu-Chun Wang Kuo-Shu Huang Zhen-Ying Hsieh Hsin-Chia Yang Chuan-Hsi Liu Chii-Ruey Lin

作者单位: Department of Electronic Engineering, Ming-Hsin University of Science and Technology, HsinChu, Taiwa Department of Electronic Engineering, Ming-Hsin University of Science and Technology, HsinChu, Taiwa Graduate Institute of Mechatronic Engineering, Taipei University of Technology, Taiwan, China Department of Mechatonic Technology, Taiwan Normal University, Taiwan, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 472-475

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）