A Capacitive Pressure Sensor Using Hybrid Silicon-Glass Structure for Hermetic Wafer Level Packaging

摘要：

A design of barometric capacitive pressure sensor is presented in this paper, which is compatible with the standard CMOS process, and a new wafer level packaging is used to seal the vacuum cavity with a glass-silicon hybrid wafer which has a certain pattern. The electrodes of the sensor are leaded out by through silicon via (TSV) technology from back side of the silicon substrate. Mechanical characteristics of the sensor are analyzed by ANSYS. The initial gap of both electrodes formed the capacitor is 2 μm, and the size of the square membrane is 700 μm. The simulation results show the sensitivity of the sensor is 2.84fF/hPa, and the nonlinearity of the device is less than 1.1％ over a dynamic range 700-1100 hPa. It is shown that the device is suitable to be used in measuring the barometric pressure.

作者: Meng Nie Qing-An Huang Ming Qin Wei-Hua Li

作者单位: Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, 210096, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 534-537

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）