Design of a Capacitive Pressure Sensor Based On Flip-Chip Packaging Technology

摘要：

This paper proposed a capacitive pressure sensor using flip-chip packaging technology to seal the vacuum cavity, and the sensing part is a variable capacitor with conductor/dielectric/conductor structure. Mechanical characteristics of the sensor were theoretically analyzed based on a composite membrane theory and evaluated by finite element analysis (FEA), showing that the difference of the model is within 8％ compared to finite element analysis results. The back side flip-chip process can achieve waferlevel vacuum cavity packaging avoiding high voltage applied during conventional anodic bonding process and at the same time resolving the feed-through problem.

作者: Meng Nie Qing-An Huang Ming Qin Wei-Hua Li

作者单位: Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, 210096, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 538-541

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）