Finite Element Method Based Stress Analysis and Warpage Prediction of SIM Card Packaging
SIM cards have been more and more widely used and the failure of packaging becomes a remarkable issue. In this paper, effects of die thickness and layout, material properties and packaging process parameters on the stress of dies were analyzed based on finite element simulation. The whole simulation includes two main packaging processes: cooling after die attach and molding process. The warpage of SIM card after packaging was also researched. The results reveal that the die stress is sensitive to the die thickness and material property can also affect the stress level and warpage. To lower the die stress and package warpage, manufacturers should pay enough attention to material selection and process parameter set.
Mingzhi Dong Jian Cai Yigao Chen Qian Wang Xinyu Dou Shuidi Wang
Tsinghua National Laboratory for Information Science and Technology Institute of Microelectronics, T Jiangsu Changjiang Electronics Technology Co., Ltd, Jiangyin, 214429, P. R. China Tsinghua National Laboratory for Information Science and Technology Research Institute of Informatio
国际会议
西安
英文
556-558
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）