Study of Mixed-Signal Crosstalk in 3-D Package
With the development of miniaturization, multi-function, environmental protection and other aspects of electronic products, high-density integration technology such as Systemon Chip (SOC) and System-in-Package (SIP) technology has developed rapidly. Mixed-signal integrity in multi-chip integration packages is a main issue. To meet the demand for high-density, 3-D chip stacking is one solution to reduce size and increase the integration. In this paper, three methods are implemented and contrasted: (1) sweep the stack sequence of RF chip and digital chip; (2) investigate the crosstalk with or without adding shielding layer to the stacked dies; (3) investigate the crosstalk with varying the density of ground points on the shielding.
Shuhua Liu Liqiang Cao Jun Li Yunyan Zhou Jing Zhou Qidong Wang Fengwei Dai Lixi Wan Daniel Guidotti
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
国际会议
西安
英文
559-562
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）