Robust optimization design of 3D MCM packages for reducing warpage under uncertainty
One critical issue for manufacturing 3D MCM packages is the warpage induced during the process. The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and optimized to reduce the warpage in many previous literatures. However, the design parameter values are not always precisely known but can contain a level of uncertainty to some extent due to, for example manufacturing tolerance. In some case, the design parameters variations can not be neglected. In this paper, the effect of structure geometry tolerance and material property tolerance on package warpage robustness was took into account and analyzed. The robust optimization mathematic model of the 3D packages, considering the uncertainty of the design parameters, was built. And the robust optimization method based on the Monte-carlo simulations and Genetic Algorithm was present to solve the optimization problem above. Firstly, the parametric design finite element model of the specific 3D MCM package was built. Secondly, the statistic distribution of the warpage induced by the design parameters variations was obtained based on the Monte-carlo simulations. Finally, the GA was implemented to optimize the mean value and standard deviation of the warpage. The resulting robust optimization design shows that the robust optimization design is insensitive to variations on design variables within a feasible region.
Gong Yu-bing
School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin, China,541004
国际会议
西安
英文
571-575
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）