12-Channel Board-Level Multi-GHz Optical Link Using Cross-Switch Chips and Optoelectronic Multi-Chip Package Modules
High density, large bandwidth and lower power consumption link and switch inter-system is required. Shortdistance parallel optical link has become the hotspot of research because of its advantage compared with electrical link. Board communications have received a lot of attention. Most of the recent developments target 10Gbps-class systems such as super computers or high-speed IP switches. This paper demonstrates a complete short-distance parallel optical link on PCB-level based on optoelectronics multi-chip package structure for high-speed signal conversion and two cross-point chips integrated as switch used to complete signal crossassignment. Optoelectronic package modules we fabricated are 12-channel multi-chip modules based on an advanced coupling method with high coupling efficiency. The electrical problems related to signal integrity (SI) is discussed and some simulation results are showed. To demonstrate switch intersystem, two12-channel cross-point chips are placed on PCB board, signal can be reassigned to any output channel to complete 12-channel cross-switches. The ends of 12 fibers on the board are passively aligned with VCSEL and PD. The following sections present the system design as well as measurement results.
Fengman Liu Zhihua Li Wei Gao Haifei Xiang Jian Song Baoxia Li Lixi Wan
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China Institute of Microelectronics, Chinese Academy of Science; Beitucheng Westroad 3＃,Chaoyang Distrcit,Beijing,100029, China
国际会议
西安
英文
587-589
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）