Signal Integrity Design and Validation for Multi-GHz Differential Channels in SiP Packaging System with Eye Diagram Parameters

摘要：

Differential interconnect lines in multi-gigabits system in package (SiP) packaging system are studied in this paper. The performance of interconnect lines can be easily estimated with jitter and eye opening using the eye diagram that is very helpful metric. To maintain good eye-diagram with high voltage swing and low timing jitter, a signal integrity (SI) design flow of SiP is proposed based on eye-diagram parameters. To validate the influences of SI design to eyediagrams, the relationship between the parameters of eye diagram and the structures of the impedance discontinuities physical elements such as vias, SMT pads are studied by a combination of software simulation and hardware validation. Some SI design rules are stipulated. As an example, a 4 channel×10Gbp/s/channel optical transceiver in an SiP package is designed.

作者: Wei GAO Fengman LIU Qidong WANG Jian SONG Haifei XIANG Jing ZHOU Xu ZHANG Feng CHEN Lixi WAN Shuhua LIU Liqiang CAO Daniel Guidotti Jun LI Zhihua LI Baoxia LI Yunyan ZHOU

作者单位: Institute of Microelectronics, Chinese Academy of Sciences Beijing, 100029, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 607-611

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）