Deformation Analysis of Multilayer Board in the Lamination Process
The deformation of core board affects the quality of circuit board, like misalignment, during lamination process of MLB (Multilayer Board). Three main factors causing the deformation are discussed, which are the mismatch of CTE (Coefficient of Thermal Expansion) among different materials, the residual stress in core boards and the special properties of the prepreg. Considering properties changing of the prepreg stage, the model of each stage in lamination process is developed. Then the deformation of core boards in a six-layer MLB is simulated using ANSYS software. Finally, the film compensating factor of 1.15 is determined according to the analysis results, and it is close to the actual factor applied in PCB manufacture process.
Peng Xu Dan Deng Dong Liu Tuanfen Gao Fengshun Wu Longzao Zhou Weihong Peng
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology,Wuhan, Shenzhen Suntak multilayer circuit board Co., Ltd, Shenzhen, P.R. China, 518054 State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Scie
国际会议
西安
英文
612-615
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）