会议专题

Numerical Investigation on the Thermal Properties of the Micro-cooler

The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the present paper, micro-pin-fin heat sink with gas impinging jet as the cooling medium is analyzed. The heat dissipation of forced air convection cooling with micro-pin-fin structures made of aligned carbon nanotube arrays has been taken into consideration. The three-dimensional computational fluid dynamics (CFD) simulation was carried out. The temperature distribution and the pressure drop are studied in the cases of various geometrical parameters of the micro-pin-fin heat sinks at the same heating power prescribed. The fluid flow and the heat transfer phenomena in the micro-pin-fins heat sinks are investigated. The heat removal efficiency of the air micro-cooler is evaluated. An array of 8×8 fins with the optimized fin-to-base length ratio achieves the best cooling effect.

Yangming Liu Yan Zhang Shun Wang Johan Liu

Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, Sch Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, Sch

国际会议

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

西安

英文

634-638

2010-08-16(万方平台首次上网日期,不代表论文的发表时间)