Reliability Design for Exposed Pad and Low-profile Leadframe Package
This paper focused on the delamination study of low profile leadframe package with exposed pad (eLQFP). In this type of package, a specification of silver plating area is required for bond pad. With the shrinkage of the non-plating pad area, and because of low adhesion strength between silver and mold compound, the interface of mold compound and diepad in the silver plating area may potentially delaminate especially after moisture sensitivity level 3 test (MSL3) and IR reflow. The study is to define a design guideline and mold compound selection rule for minimum delamination after MSL3 & IR reflow. Firstly, a safety factor K is defined as delamination guideline. Then the structure parameters were prioritized for their impact to the factor K. Thirdly, a DOE was carried out to study the mold compound property effect on the delamination. Guided by the simulation in structure and mold compound study, a group of test vehicles were designed to validate the reliability. The result shows the well-defined safety factor K was workable for eLQFP failure evaluation.
Y. B. Yang X. R. Zhang W. H. Zhu J. C. Teddy Y. W. Liang S. Nathapong C. Surasit
United Test and Assembly Center 5 Serangoon North Avenue 5, Singapore 554916
国际会议
西安
英文
643-647
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）