Reliability Metrics for IGBT Power Modules
In the field of IGBT modules, there is currently a plethora of new packaging materials being developed with a view to increased “reliability. Whilst this approach is often essential to meet the needs for the ever increased demand in harsher environments, the result can often be seen as an overengineered solution with resultant excessive cost. This paper will present a case study addressing how process control techniques of the substrate solder can demonstrate a significant improvement in the reliability of the product.
D.R.Newcombe Dinesh Chamund C. Bailey H. Lu
Dynex Semiconductor Ltd.,Doddington Road, Lincoln, LN6 3LF , UK School of Computing and Mathematical Sciences, Greenwich University 30 Park Rod, London SE10 9LS, UK
国际会议
西安
英文
670-674
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）