A Novel Piezoresistive Stress Sensing Method in Flip Chip Technology
Stress in flip-chip (FC) packaging process will have a great effect on the performances and reliability of the packaged devices, especially the mechanical parts. 12 Flip chips with various bump-area-arrays have diverse stress distributions due to temperature loads. Since the top surface of the chip is not exposed to optical observation, the traditional full-field optical measurement techniques are not suitable for the quality characterization of FC. In this paper, Finite Element Model (FEM) is established for flip chips with 3×3, 6×6, 9×9 bump-area-arrays respectively. In addition, a new sensing method based on piezoresistive sensing and stress isolation is presented to improve the accuracy of the quality characterization. Finally, a manufacturing process of the novel piezoresistive stress sensor is designed.
Jie Shen Jing Song Jieying Tang
Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 210096, China
国际会议
西安
英文
675-678
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）