会议专题

A System-Level Equivalent Circuit Method for the Electrical Performance Modeling of Electronic Packages

In this paper, we propose a system-level field-circuit method for the signal integrity and power integrity simulation of power distribution networks inside the electronic packages. The electromagnetic field inside the power distribution network is expressed in the modal field distribution. The modal field is then decomposed into the parallel plate mode and transmission mode, which are related to the powerground planes and signal traces respectively. Integral equations are created for these two modes. Through the discretization of the integral equations, network ports are defined between the power/ground planes and signal traces. In this way, their equivalent networks are extracted through the moments method solution of the integral equations. Finally, these two equivalent networks are combined together with the equivalent circuit of the through-hole via to provide the whole circuit model of the power distribution network. Through numerical examples, the accuracy and efficiency of the proposed method are verified.

Xing-Chang WEI Er-Ping LI

Institute of High Performance Computing, Singapore 138632 Zhejiang University, Hangzhou, China 310058.

国际会议

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

西安

英文

683-686

2010-08-16(万方平台首次上网日期,不代表论文的发表时间)