Optimization Design of a 64-Lead Low-Profile Quad Flat Package for RFIC Applications
Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on commercial electromagnetic analysis software HFSS, a standard 64-Lead Low-Profile Quad Flat Package was used to create optimized package model and its S parameters were simulated. Simulation results indicate that the optimized model has extended the RFIC package bandwidth to higher frequencies. The bandwidth measured for insertion loss (S31), return loss (S11), and coupling (S21) is 4.7GHz (at -1dB), 4.9GHz (at 15dB), and 2.7GHz (at -15dB). Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34％, 58％, and 69％ respectively.
Haiyan Sun Jianhui Wu Ling Sun Weiping Jing
National ASIC System Engineering Research Center, Southeast University, Nanjing 210096, P.R. China;J National ASIC System Engineering Research Center, Southeast University, Nanjing 210096, P.R. China; Jiangsu Provincial Key Lab of ASIC Design, Nantong University, Nantong 226019, P.R. China
国际会议
西安
英文
499-502
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）