Thermally Induced Packaging Effect of a Distributed MEMS Phase Shifter

摘要：

Since radio-frequency microelectromechanial devices work mechanically, they are sensitive to thermally induced packaging effects. These effects will have impacts on their microwave performances and reliability. In this paper, the possible effect of the thermal stress and strain induced in die attaches process on the microwave characteristics of packaged distributed MEMS phase shifters is studied. Theoretical models are established, and full wave electromagnetic simulations are involved. Results show that the thermally induced packaging effect has considerable impact on the phase shift performance of the device.

作者: Cheng Zhao Jing Song Qing-An Huang

作者单位: Key Laboratory of MEMS of Ministry of Education, Southeast University Nanjing 210096,China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 508-510

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）