Thermal Aging of Molding Compounds
The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175℃ for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the glass transition temperature increased and that these effects are accompanied with a relatively large amount of shrinkage. All effects can be interpreted in terms of the formation of an oxidized layer where extra crosslinking occurred.
K.M.B. Jansen J. de Vreugd L.J. Ernst C. Bohm
Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands Infineon Technologies AG, 81726 Munich, Germany
国际会议
西安
英文
778-780
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）