Electrical Simulation Research for IC Package Gold Bonding Wire

摘要：

With the development of semiconductor technology, the IC frequency become higher and higher, and the IC package become more and more importance. Currently, the wiring bonding is mainly used to connect die and package pads, so parasitical parameter of bonding wire must be considered especially for RFIC and MMIC component. It was discussed by finite element simulation and analysis in this paper that the different standard gold bonding wires have different effects on the parasitical parameter and the electrical performance of one ideal amplifier.

作者: Cao Yusheng Du Shuan Yao Quanbin Zhao Yuanfu

作者单位: Beijing Microelectronics Technology Institute 2. Siyingmen N.Rd. Donggaodi Fengtai district. Beijing . PRC

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 781-783

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）