Effects of IMC Thickness on Fracturing of Solder Joints

摘要：

Cracking along the intermetallic compound (IMC) interface in solder joints is the most important failure mechanism in electronics packages. In order to understand the failure mechanism well, a 2D solder/IMC interface model is used to examine the stress around the interface. Three solder materials, Sn37Pb, Sn3.5Ag and Sn3.0Ag0.5Cu, and various IMC thicknesses, which represent different growth stages of the IMC, are considered to investigate their effects on the interfacial stress. The stress intensity factor, H, which is used as bi-material interface failure criterion, are calculated for various IMC thicknesses.

作者: WANG Chunke QIN Fei AN Tong

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing 100124, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 511-514

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）