Study of Signal Integrity for PCB Level
With the rapid development of high-speed digital circuits and high-integration-chip technology, more high-speed signals need to be transferred in high-speed interconnection. However, high-speed signals will experience delay, reflection, attenuation and crosstalk during the transferring. The transmission characteristic of printed circuit board (PCB) is very important as PCB is the support for the whole circuit systems. As the signal integrity is very critical for the electronic products, both designers of high-speed circuit and PCB manufactures focus on solving the signal integrity problem. Signal integrity in high-speed circuit design is very important. In this study, discontinuous ground and the via hole signal integrity analysis in the PCB level were carried out on the basis of transmission lines. Based on the results of the experiments, guidelines for design and manufacturing process were proposed to improve the signal integrity problem. With the rapid development of electronic technology, largescale and super large-scale integrated circuits are used in the systems. The size of the Integrate circuits chip is smaller and smaller, and the I/0 amount is more and more according to the package type of integrate circuits chip. And the speed of the signal is more and more fast with the development of the integrate circuits process. How to deal with the high-speed signal becomes the key while engineers design the circuits because of the smaller size of the electronic design, the higher density of the circuit layout, and the higher and higher frequency of the signal. With the rapid development of highspeed digital circuits and high-integration-chip technology, influence of the transmission line and delamination characteristic on system electronical performance is more and more important. Therefore, high speed system design need to solve signal integrity problems of delay 、crosstalk and transmission line effect, and so on. The influence of the high-speed interconnection on signal integrity includes two parts. Firstly, delay, reflection, and crosstalk effect of transmission line because of the impedance mismatch, discontinuous interconnection. Secondly, isochronous Switching Noise (SSN), for some circuits sharing the ground or feeder with the EMC. The first part was carried out in this article.
Jiang Jing Kong Lingwen
Shennan circuits Co., Ltd. East Gaoqiao Industrial Zone, Pingdi Street, Longgang District, Shenzhen, China
国际会议
西安
英文
828-833
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）