Preparation and Characterization of Ultrasonic Electrodeposited Copper Coating
Copper has replaced aluminum as the main interconnect material in VLSI, due to its low resistivity and high electromigration resistance. The property of copper coating is a key factor that determines the reliability of interconnects. A special copper coating was prepared by ultrasonicelectrodeposition method in this study, and the microstructure, hardness, wear resistance, adhesion and corrosion resistance of it were investigated respectively. Test results show that the crystallite size of it is obviously smaller than that of the ordinary electrodeposited copper coating, and the hardness, wear resistance, adhesion and corrosion resistance of it are all evidently enhanced.
Ronghong Cui Yuting He Zhiming Yu Wenjun Shu Jinqiang Du
Engineering College, Air Force Engineering University, Xi’an, 710038, China State Key Lab. For Corro Engineering College, Air Force Engineering University, Xi’an, 710038, China State Key Lab. for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Science
国际会议
西安
英文
847-850
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）