A Study to Performance of Electroplating Solder Bump in Assembly

摘要：

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.

作者: Mu-Chun Wang Kuo-Shu Huang Zhen-Ying Hsieh Hsin-Chia Yang Chuan-Hsi Liu Chii-Ruey Lin

作者单位: Department of Electronic Engineering, Ming-Hsin University of Science and Technology, HsinChu, Taiwa Department of Electronic Engineering, Ming-Hsin University of Science and Technology, HsinChu, Taiwa Graduate Institute of Mechatronic Engineering, Taipei University of Technology, Taiwan, China Department of Mechatonic Technology, Taiwan Normal University, Taiwan, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 794-797

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）